JPS6314461Y2 - - Google Patents

Info

Publication number
JPS6314461Y2
JPS6314461Y2 JP1983078093U JP7809383U JPS6314461Y2 JP S6314461 Y2 JPS6314461 Y2 JP S6314461Y2 JP 1983078093 U JP1983078093 U JP 1983078093U JP 7809383 U JP7809383 U JP 7809383U JP S6314461 Y2 JPS6314461 Y2 JP S6314461Y2
Authority
JP
Japan
Prior art keywords
wafer
opening
frame
mounting table
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983078093U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59182933U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983078093U priority Critical patent/JPS59182933U/ja
Publication of JPS59182933U publication Critical patent/JPS59182933U/ja
Priority to US06/852,594 priority patent/US4652135A/en
Application granted granted Critical
Publication of JPS6314461Y2 publication Critical patent/JPS6314461Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP1983078093U 1983-05-23 1983-05-23 ウェーハ装着機 Granted JPS59182933U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1983078093U JPS59182933U (ja) 1983-05-23 1983-05-23 ウェーハ装着機
US06/852,594 US4652135A (en) 1983-05-23 1986-07-03 Article holding apparatus and its use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983078093U JPS59182933U (ja) 1983-05-23 1983-05-23 ウェーハ装着機

Publications (2)

Publication Number Publication Date
JPS59182933U JPS59182933U (ja) 1984-12-06
JPS6314461Y2 true JPS6314461Y2 (en]) 1988-04-22

Family

ID=13652243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983078093U Granted JPS59182933U (ja) 1983-05-23 1983-05-23 ウェーハ装着機

Country Status (2)

Country Link
US (1) US4652135A (en])
JP (1) JPS59182933U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245279A (ja) * 2005-03-03 2006-09-14 Nitto Denko Corp 判別機能付き位置決め装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5024207A (en) * 1989-10-30 1991-06-18 Motorola, Inc. Heating apparatus and method for semiconductor material slicing process
DE4117969C2 (de) * 1991-05-31 2000-11-09 Balzers Ag Liechtenstein Vakuumkammer
JP3417821B2 (ja) * 1997-11-17 2003-06-16 ティーディーケイ株式会社 クリーンボックス、クリーン搬送方法及び装置
US6150240A (en) * 1998-07-27 2000-11-21 Motorola, Inc. Method and apparatus for singulating semiconductor devices
US6561894B1 (en) 1999-04-19 2003-05-13 Tdk Corporation Clean box, clean transfer method and apparatus therefor
US7281535B2 (en) * 2004-02-23 2007-10-16 Towa Intercon Technology, Inc. Saw singulation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3752589A (en) * 1971-10-26 1973-08-14 M Kobayashi Method and apparatus for positioning patterns of a photographic mask on the surface of a wafer on the basis of backside patterns of the wafer
US3937579A (en) * 1972-11-20 1976-02-10 Karl Suss Kg Process for the double-sided exposure of a semiconductor or substrate plates, especially wafers, as well as apparatus for the purpose of parallel and rotational alignment of such a plate
US4040736A (en) * 1973-09-12 1977-08-09 Kasper Instruments, Inc. Step-and-repeat projection alignment and exposure system
US4326805A (en) * 1980-04-11 1982-04-27 Bell Telephone Laboratories, Incorporated Method and apparatus for aligning mask and wafer members

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006245279A (ja) * 2005-03-03 2006-09-14 Nitto Denko Corp 判別機能付き位置決め装置

Also Published As

Publication number Publication date
US4652135A (en) 1987-03-24
JPS59182933U (ja) 1984-12-06

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